Capabilites

Laser Cut Stencil Capabilities

  • Cutting Area x= 24” y=28”
  • Process cutting accuracy of +/- .0002” (+/- 5um) over the entire work area
  • Cut width .0015”
  • Cut Features as narrow as .002”
  • Utilizing the finest grain stainless material
  • Material Thickness from .002” (2mil) to .020” (20mil)
  • 24-hour turnaround standard
  • 9000 apertures/hour capability
  • Data: Gerber, HPGL, DPF and more..

Printed Circuit Board General Capabilities

  • Layer Count: 1-26 Layers
  • Material: FR-4, 170TG, Rogers, CEM , Teflon
  • Min Plated Thru Holes: 0.005" (0.127 mm)
  • PTH Tolerance: +/- 0.003" (0.076 mm)
  • Min Aspect Ratio: 10:1 (THK:DHS)
  • Copper: 3 oz Inner Start/ 5 oz Outer Start
  • Routing Tolerance: +/- 0.004
  • Min Trace/Space: 0.004"/0.004" (0.1/0.1 mm)
  • Thickness: 0.008”/0.240”
  • Finish: ENTEK,HASL, Lead-free HASL, Hard Gold, Immersion Gold, Immersion Silver, OSP
  • Options: Gold Tabs, Selective Au, Carbon Ink, Peelable Mask, Micro Via, Controlled
    Impedance, Score, Punch & Return, LASER Drill, Blind Vias and Buried Vias