Laser Cut Stencil Capabilities
- Cutting Area x= 24” y=28”
- Process cutting accuracy of +/- .0002” (+/- 5um) over the entire work area
- Cut width .0015”
- Cut Features as narrow as .002”
- Utilizing the finest grain stainless material
- Material Thickness from .002” (2mil) to .020” (20mil)
- 24-hour turnaround standard
- 9000 apertures/hour capability
- Data: Gerber, HPGL, DPF and more..
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Printed Circuit Board General Capabilities
- Layer Count: 1-26 Layers
- Material: FR-4, 170TG, Rogers, CEM , Teflon
- Min Plated Thru Holes: 0.005" (0.127 mm)
- PTH Tolerance: +/- 0.003" (0.076 mm)
- Min Aspect Ratio: 10:1 (THK:DHS)
- Copper: 3 oz Inner Start/ 5 oz Outer Start
- Routing Tolerance: +/- 0.004
- Min Trace/Space: 0.004"/0.004" (0.1/0.1 mm)
- Thickness: 0.008”/0.240”
- Finish: ENTEK,HASL, Lead-free HASL, Hard Gold, Immersion Gold, Immersion Silver, OSP
- Options: Gold Tabs, Selective Au, Carbon Ink, Peelable Mask, Micro Via, Controlled
Impedance, Score, Punch & Return, LASER Drill, Blind Vias and Buried Vias
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